Micro Via
A by using that has a smaller gap diameter. It refers to the through that has a smaller sized hole diameter than a normal by means of hole, but there's no crystal clear definition. Laser vias, which might be laser drills, are suitable for processing micro vias.
Laser by way of
Drilling with laser. According to the wavelength, there are actually some which have holes only as many as the conductor layer for the reason that they may be reflected by copper, and others that penetrate all. Massive and deep drilling with low electrical power lasers can decrease the trustworthiness with the substrate thanks to prolonged heating. Considering the fact that holes are sequentially drilled, it will require time in proportion on the amount of holes.
photo By using
By exposing and developing with masking the destinations aside from the holes to melt the insulating layer to variety holes. Following that, the mask is taken out by washing. Since it really is a batch drilling, the processing time is identical although there are several holes, but it really will not be ideal for deep drilling. Because copper will not be melted, it stops on the conductor layer, in order that it is actually necessary to devise a way for drilling many levels.
punching
Drill all by way of holes simultaneously applying a push. Suited to gentle substrates.