Major defects ( failure manner )
In combination with circuit defects , several conduction and insulation defects are triggered by flaws like solder and resist . See Digital Circuit Engineering , Built-in Circuit Engineering , Failure Modes of Electronics for additional info on this place .
Circuit sample, missing by means of hole ( disconnection )
Through-hole disconnection (disconnection of through-hole plating, disconnection between through-hole plating and internal layer connection)
Brief ( shorter circuit ).
Leakage present , spark ( English variation ) Electromigration.
Chipping, cracking and dent scratches to the substrate ,Silk printing printing misalignment Void-A hollow delamination caused by bubbles.Crack-A crack from the plating layer.
Smear-Adhesion of substrate resin for the conductor within the outlet.
Delamination-peeling amongst layers within just a multilayer board. At times abbreviated as Delami.
Out of land-hole is from situation.Crazing, measling-glass fiber exfoliation.
Hi ring, pink ring-whitening during processing of the substrate edge.Barrel crack (round crack in as a result of hole),Deviation of resist ink development printing Head in pillow- Solder pillow defect in the course of BGA mounting.